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Product description
Professional Surface Mount Technology Assembly Line
" Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to
temporarily attach one or several electrical components to their contact pads, after which the entire assembly
is subjected to controlled heat, which melts the solder, permanently connecting the joint. Shenzhen Sunsoar Circuit factory,
established in 2008, is a high-end PCB&PCBA manufacturer in PCB and components assembly fields.."
Best PCB Wave Soldering Service From Sunsoar Circuit
" PCB Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is
passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave.
Shenzhen Sunsoar Circuit Factory has own pcb wave soldering lines and manual DIP soldering lines, it can meet the
different customer’s needs."
Items |
PCB Assembly Technical Data |
1. |
Professional Surface-mounting and Through-hole soldering Technology |
2. |
Various sizes like BGA,QFN,0402,0201 components SMT technology |
3. |
ICT(In Circuit Test),FCT(Functional Circuit Test) technology. |
4. |
PCB Assembly With UL,CE,FCC,Rohs Approval |
5. |
Nitrogen gas reflow soldering technology for SMT |
6. |
High Standard SMT&Solder Assembly Line |
7. |
High density interconnected board placement technology capacity |
8. |
AOI Testing, Fuction testing,working testing |
| SHENZHEN YUZHIXIANG ELECTRONICS CO., LTD | |
| Sunsoar Precision Electronic (HK) Limited | |
| Production Capability | |
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , 22F, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
| Layer No. | 1 - 20 Layers |
| Board thickness | 0.0075"(0.2mm)-0.205"(5.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.5OZ - 5OZ |
| Impedance Control | ±10% |
| Warpage | 0.075%-1.5% |
| Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
| Min Trace Width (a) | 4mil(0.1mm) |
| Min Space Width (b) | 4mil(0.1mm) |
| Min Annular Ring | 0.15mm |
| Min. BGA Pitch (b) | 0.25mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Soldermask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Aspect Ratio | 6:01 |
| Hole Registration | 0.004"(0.1mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004'(±0.1mm) |
| Beveling | 30° 45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish |
HASL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon INK |
| Certificate | ROHS ISO9001:2000 SGS UL |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
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